ME学术大讲堂第八十八讲:A Control-Chart-Based Method for Solder Joint Crack Detection
来源:机械工程学院 发布日期:2018-08-02 浏览次数:195
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地点:屏峰校区校区机械楼B524

时间:82日,18:30-19:30

报告人:潘建标

主讲人简介:

潘建标,美国加州州立理工大学工业与制造工程系教授,曾获西安电子科技大学电子机械学士学位,清华大学精仪系制造工程硕士学位,美国理海大 Lehigh University)工业工程博士学位。

潘教授是国际微电子与封装协会(IMAPS)会士 Fellow), 电子与电气工程师协会(IEEE)高级会员,制造工程师协会(SME)高级会员,和美国质量协会(ASQ) 注册质量工程师和注册可靠性工程师 。曾获2011 国际微电子与封装协会杰出教育工作者奖,2007Emerald Literati 年度论文表扬奖,2004年美国制造工程师协会颁发的杰出青年制造工程师奖。现担任Journal of Microelectronics and Electronic Packaging主编,IEEE Transactions on Components, Packaging and Manufacturing Technology副主编。

 

摘要:

Many researchers have used different failure criteria in published solder joint reliability studies. Since the reported time to-failure would be different if different failure criteria were used, it would be difficult to compare the reported reliability life of solder joints from one study to another. The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and determine which failure criterion could detect failure sooner.